ELECTRONIC PRODUCT DESIGN & TECHNOLOGY
(In collaboration with CDAC, Mohali)
1st Semester |
S. No. |
Course Code |
Subject |
L |
T |
P |
Credits |
|
1 |
EC 511 |
Electronic System Design |
4 |
0 |
0 |
4 |
|
2 |
EC 516 |
Designing with Power Devices |
4 |
0 |
0 |
4 |
|
3 |
MA 501 |
Advanced Mathematics |
4 |
0 |
0 |
4 |
|
4 |
|
Elective I |
4 |
0 |
0 |
4 |
|
Elective I |
S. No. |
Course Code |
Subject |
|
|
|
|
|
1 |
EC 512 |
Microelectronics |
|
|
|
|
|
2 |
EC 517 |
Manufacturing Technology of Electronic Equipment |
|
|
3 |
IT 501 |
Information Security (OE) |
|
|
|
|
|
Course Name : ELECTRONIC SYSTEM DESIGN
Course Code : EC 511
Credits : 4
L T P : 4 0 0
Lecture wise breakup No of lectures
DESIGN CONCEPTS (04)
Digital Hardware, Design Process, Design of Digital Hardware
LOGIC CIRCUITS (08)
Variables & Functions Logic gates & Networks synthesis, SOP, POS forms, Introduction to VHDL.
OPTIMIZED IMPLEMENTATION OF LOGIC FUNCTIONS: (10)
Strategy for minimization, Incompletely specified functions, Multiple output circuits, Multilevel synthesis & Analysis
COMBINATIONAL CIRCUITS (05)
Building Block, Multiplexers Decoders, Encoders Code Converters.
SYNCHRONOUS SEQUENTIAL CIRCUITS (08)
Basic Design Steps, Mealy state Model, Design of FSM,
ASYNCHRONOUS SEQUENTIAL CIRCUITS (08)
Analysis, Synthesis, State Reduction, State Assignment, Hazards.
DIGITAL SYSTEM DESIGN (04)
Building Block Circuits.
TESTING OF LOGIC CIRCUITS (08)
Fault Model, Path sensitizing, Random testing, Circuits with Tree Structure.
BOOK:
1. Introduction to Logic Design – MARCOVITZ – (Text )
REFERENCES:
- Engineering Digital Design – TINDER
- An Engineering Approach to Digital Design – FLETCHER
- Logic and Computer Design Fundamentals – MANO
Course Name : MICROELECTRONICS
Course Code : EC 512
Credits : 4
L T P : 4 0 0
Lecture wise breakup No of lectures
MICROELECTRONICS TECHNOLOGY (3)
Introduction, and its use in I.C. fabrication. Scales of integration from SSI to ULSI.
CRYSTAL GROWTH (5)
Single Crystal growth of Silicon and Gallium Arsenide. Substroth slicing and polishing. Zen refining of Semiconductor crystals.
OXIDATION (4)
Oxide layer growth on Silicon wafer surface. Oxidation in the presence of dry oxygen & wet oxygen. Oxide layer growth along various crystal directions.
DIFFUSION (4)
Solution to Fick’s Laws Junction formation. Diodes, transistors and MOSFETs.
EPITAXY (4)
VPE, LPE and MBE: Individual epitaxial units, their operation and quality of film growth.
ION IMPLANTATION (4)
The process and techniques for formation of ion-implanted doped layers and their characteristics.
THIN FILM DEPOSITION (4)
Growth of thin metallic films. Normal and ultra-high vacuum systems. Thickness monitors.
CHEMICAL VAPOUR DEPOSITION (4)
Growth of CVD films. Growth mechanism and characterization. MOCVD.
STANDARD BIPOLAR, NMOS AND CMOS CIRCUITS (4)
Processing and fabrication using circuit layout. Process evaluation.
THE SI-MOS CAPACITOR (2)
Its fabrication and characteristics.
SUB MICRON DEVICE PHYSICS AND TECHNOLOGY (8)
Review of basic device physics, MOS capacitor and transistor theory, Moore’s law on technology scaling, MOS device scaling theory, Short channel effects, sub threshold leakage, Punch through, DIBL, High field mobility, Velocity saturation and overshoot, ULSI technology, Nano fabrication
BOOKS:
- Fundamentals of semiconductor Fabrication- S. M Sze , G May
- Physics of semiconductor devices- S.M Sze
REFERENCES:
1. Microelectronics: Theory Design and Fabrication by Edward Keonjian
2. Microelectronics –Jacob Millman
Course Name : DESIGNING WITH POWER DEVICES
Course Code : EC 516
Credits : 4
L T P : 4 0 0
Lecture wise breakup No of lectures
POWER DEVICES (05)
Characteristics & protection of Power, Devices such as GTOs, IGBTs, RCTs, MCTs, SITHs, LASCRs
TRANSFORMER (09)
Fundamentals, Selection of core material, Insulating material and wires, Design Methodology of pulse transformers, High Frequency transformers, Design of Transformers for PWM converters
COILS (04)
Fundamentals, Selection of core material, Insulating materials and wires, Design of inductors for power frequency, Radio frequency & High frequency
SWITCH MODE POWER SUPPLIES (14)
Basic regulators-Buck,Boost, Buck Boost, Derived topologies-flyback, forward, Pushpull, half & full bridge converter, Special converters Like Cuk’ converter, PWM control techniques, Study of PWM control Ics,Design of base derive circuits, Design of input section, output section & control section, Thermal design concepts, EMI/EMC considerations, Protection circuit design for power supplies
UPS & OTHER POWER SUPPLIES (08) Concept of AC & DC resonant power supplies, Concept of AC & DC Bi-Directional power supplies, Concept of Unonterrupted power supplies, Solar cells as power source devices & Their characteristicsBOOK:
- George Chryssis, ‘High frequency switching power supplies: theory & design” McGraw Hill Book Co. 1984 (Text)
REFERENCES:
1. K.Kitsum, “ Switch mode power conversion –basic theory and design” Marcel Deckker Inc, 1984
2. N.Radhakrishnan and S.R.Bhat, “Design and technology of low power transformers and inductors” CEDT, July 1998
Course Name : MANUFACTURING TECHNOLOGY OF ELECTRONIC EQUIPMENT
Course Code : EC 517
Credits : 4
L T P : 4 0 0
Lecture wise breakup No of lectures
INTRODUCTION (03)
Design for Manufacturing, Design for PrototypingCAD FOR PRINTED CIRCUIT BOARDS (09) Layout rules & parameters, Design considerations for digital PCBs, High Frequency PCBs, Analog PCSs, Power Electronics PCBs, Microwave PCBs, Multilayer PCBs Design Considerations, Detail of Manufacturing Practices. SURFACE ENGINEERING OF EQUIPMENT SHELLS (06) Theory and Practices, Corrosion and its protection, Metal Plating, Polymer coating technology JOINING TECHNIQUES (06) Soft Soldering, Assembling Techniques, Mass Assembly of Circuit boards FABRICATION TECHNOLOGY (08) Fabrication of PCBs, Mechanical Machining Operations, Tolerance, Tooling, Cost Analysis, Work and Process Analysis EMERGING MANUFACTURING TRENDS (08) Multilayer & Flexible PCBs, Surface Mount Technology & Design Considerations, Computer Aided Manufacturing, Computer Aided Engineering, Rapid prototyping, Quality Control BOOK :W.Bosshart, Design and Fabrication of PCB- (Text)
REFERENCES:1. Nievel and Draper, Product Design and Process Engineering Raskhodoff, Electronics Drafting and Design E.R.Howells, Technology of Chemical and Material for Electronics Workshop Technology, W.A.J.Chapman John E. Traister, Design guidelines for Surface Mount Tehnology
Course Name : ADVANCED MATHEMATICS (Special functions, Conformal mappings and Matrices)
Course Code : MA 501
Credits : 4
L T P : 4 0 0
Lecture wise breakup No. of Lectures
SPECIAL FUNCTIONS (24)
Series solution of differential equations, Power series methods, Legendre’s polynomial, generating functions, Recurrence relations
Frobenius method, Series solution of Bessel’s differential equation, Modified Bessel’s functions, generating functions, Recurrence relations
Equations reducible to Bessel’s equation
Sturm Liouville’s problem, orthogonal functions, orthogonality of eigen functions, eigen function expansions
Applications
CONFORMAL MAPPINGS (8)
Conformal mapping, Exponential function,, trigonometric function, logarithmic function, power function, bilinear and Schwarz-Christoffel transformation, Applications to engineering problems.
MATRICES (13)
Matrices, Minimal polynomial of a matrix, Reduction of a matrix into Jordan canonical form
Functions of square matrices, Sylvester’s interpolation formula, Quadratic and Hermitian forms
Linear vector matrix differential equations, Matrix Riccati equations BOOK1. Advanced Engineering Mathematics, Wylie and Barrett, Mc Graw Hill, 6th edition, 1995.REFERENCES1. Advanced Engineering Mathematics, Kreyszig, John Wiley and Sons, 8th edition, 2001.
2. State space Analysis Of Control Systems, K Ogata, 1967, Prentice Hall Inc.
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